Wangling WL-CT440 2-Layer 0.8mm ENIG PCB – Thermoset High Frequency Applications1. Introduction to Wangling WL-CT440 PCB Wangling's WL-CT440 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products. The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high Tg value of above 280°C. This 2-layer rigid PCB is constructed entirely with Wangling WL-CT440 as the core material, making it ideal for aerospace equipment, microwave antennas, early warning radar, airborne radar, phased array antennas, satellite communication, navigation, and power amplifier applications.
2. Key Features of Wangling WL-CT440 PCB Dielectric constant of 4.10 at 10 GHz/23°C (design Dk: 4.38) Dissipation factor of 0.0040 at 2 GHz and 0.0050 at 10 GHz Excellent TCDk of -21 ppm/°C High thermal conductivity of 0.66 W/(m·K) Low moisture absorption of 0.12% Matched to copper CTE: X-axis 14 ppm/°C, Y-axis 18 ppm/°C, Z-axis 35 ppm/°C Tg > 280°C Td of 402°C UL 94 V-0 flammability rating Volume resistivity of 1 × 10⁹ MΩ·cm Surface resistivity of 5 × 10⁷ MΩ Electrical strength (Z direction) of 27 KV/mm Breakdown voltage (XY direction) of 25 KV 3. Benefits of Wangling WL-CT440 PCB Low dielectric constant tolerance and low loss Hydrocarbon ceramic thermoset resin system for better PCB processability and heat resistance Excellent temperature characteristics of Dk with minimal variation over temperature CTE in X/Y direction matches copper; low Z-axis CTE ensures dimensional thermal stability and PTH reliability High Tg > 280°C maintains dimensional stability and PTH quality at high temperatures High thermal conductivity (0.66 W/(m·K)) outperforms comparable thermoplastic materials for high power applications Commercializable, high volume, cost-effective product Excellent radiation resistance maintains stable dielectric and physical properties after dose irradiation Low outgassing performance meets aerospace vacuum requirements FR4-compatible processing for easier manufacturing than PTFE materials Better circuit stability and consistency 4. Wangling WL-CT440 PCB Construction Details
5. PCB Stackup (2-Layer Rigid Structure) Copper_layer_1 - 35 μm (1 oz) WL-CT440 Core - 0.762 mm (30 mil) Copper_layer_2 - 35 μm (1 oz) 6. PCB Statistics Components: 37 Total Pads: 49 Thru Hole Pads: 27 Top SMT Pads: 22 Bottom SMT Pads: 0 Vias: 31 Nets: 2 7. Primary Application Areas Aerospace equipment, space and cabin equipment, aircraft Microwave, antenna, phase-sensitive antenna Early warning radar, airborne radar Phased array antenna, beam wave network Satellite communication, navigation Power amplifier 8. Quality Assurance Artwork supplied: Gerber RS-274-X Accepted standard: IPC-Class-2 Availability: Worldwide 9. Wangling WL-CT440 Thermoset High Frequency Laminate – Product Introduction Wangling's WL-CT440 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products. The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high Tg value of above 280°C. The WL-CT series offers dielectric constant options including 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15. The series materials are available with ED copper foil or reverse treated RTF copper foil. RTF copper foil provides excellent PIM performance, reduces conductor loss, and minimizes insertion loss. RTF copper foil uses an adhesive backing treatment, adding 0.018mm (0.7 mil) to material thickness while ensuring good bonding strength. The series can also be configured with an aluminum base for high-frequency aluminum-based materials. Circuit boards can be processed using FR4 board processing techniques. The excellent mechanical and physical properties of the material enable multiple lamination cycles, making it suitable for multilayer, high-multilayer, and backplane processing. It also demonstrates excellent machinability for dense hole and fine line processing.
10. Features and Benefits Summary
11. Wangling WL-CT440 Data Sheet
12. Dk Options Available (WL-CT Series) The WL-CT series offers dielectric constants including: 3.00, 3.30, 3.38, 3.48, 4.10, 6.15. 13. Some Typical Applications Aerospace equipment, space and cabin equipment, aircraft Microwave, antenna, phase-sensitive antenna Early warning radar, airborne radar Phased array antenna, beam wave network Satellite communication, navigation Power amplifier 14. Standard Thicknesses, Panel Sizes & Claddings WL-CT440 Dielectric Thickness Options WL-CT440 minimum thickness is 0.254mm (10 mil), available in multiples of 0.254mm (10 mil). Note: WL-CT440 is only available with ED copper foil (RTF not supported).
Copper Foil Options Copper thickness: 0.5 oz (0.018 mm), 1 oz (0.035 mm); other thicknesses available by custom order Copper foil types: ED copper foil, RTF copper foil (RTF is adhesive-backed, adds 0.018mm/0.7 mil to core thickness) Note: WL-CT440 and WL-CT615 are limited to ED copper foil only; other models support both copper foil types. Standard Panel Sizes 460 x 610 mm (18" x 24") 915 x 1220 mm (36" x 48") Aluminum Base Option (WL-CT*-AL)** Aluminum base material provides shielding or heat dissipation. The aluminum base is applied on the opposite side of the dielectric layer from the copper foil.
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